Berlin Fintech Pliant Raises €71.6 Million to Expand Financial Services

On 4 November 2026, Berlin-based fintech company Pliant announced an $80 million Series C funding round, equivalent to approximately €71.6 million, led by Seaya and Speedinvest. The funding will support expansion of its corporate payment and financial technology platform, creating opportunities for fintech service providers, financial advisers and technology partners. HPC can support investor introductions and strategic business partnerships.

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